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GSI Group
Announces Next-Generation Laser |
The new WaferRepair platform is designed to address the current and future technology requirements associated with the reliable, cost effective laser fuse processing of high density DRAM and other memory devices using redundancy, as well as laser programming for device customization and repair of non-memory devices. It delivers significant refinements in beam placement accuracy, laser spot size, and ultra-fine, ultra-stable energy control that enable the processing of extremely tight-pitch fuse structures for exceptional yield enhancement. It is the first production-ready platform to feature the overall system precision required by 90nm and smaller design rules. The M450 features a laser spot size of 1.4µm, meeting today’s most challenging process requirements. The M455 features a laser spot size of 0.7µm, enabling aggressive fuse pitch shrinks below 2µm. Both systems process fuses at a rate of 60,000Hz with beam-positioning accuracy of +/- 0.150µm. According
to Gary Mezack, Director of Marketing for the company’s Laser
Systems Group, “The new WaferRepair products are the most
advanced, highest value laser fuse processing systems available
today. This important new platform provides a continued path
forward for manufacturers seeking to increase yield, aggressively
shrink die size, lower costs, increase throughput, and produce
customized devices.”
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more information, please contact:
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WILMINGTON,
MA, December, 2004 — GSI Group Inc. (Nasdaq: GSLI and
TSX: GSI) announces
the introduction of its next-generation WaferRepair™ platform
for laser fuse processing applications. In addition, the company
has released two new products based on this new platform, the