GSI Group Announces
New Thin Film Chip Component Trim System

WILMINGTON, MA, March 2004 — GSI Group Inc. (Nasdaq: GSLI and TSX: GSI) announces immediate availability of the CircuitTrim® W778 Thin Film Chip Component Trim System, a high throughput, high performance laser trim system that is optimized specifically for use in adjusting the resistive values of the latest generation of thin film chip resistors and resistor networks. Based on GSI Group’ proven W770 trim system platform, this new system provides an exclusive new combination of laser pulse width, wavelength, and spot size that addresses issues specific to thin-film chip components.

The CircuitTrim W778 dramatically increases capability and throughput beyond previous industry benchmarks. It produces narrower cuts with a smaller kerf, a smaller heat-affected zone, and less microcracking. This allows cuts to be placed closer together for more total cuts – providing a greater “multiplier effect” that increases the potential resistive values to which devices can be adjusted. Devices can be precisely and consistently adjusted, with up to 200—300X their pre-trim resistive value, depending upon part type. Finally, the laser wavelength used by the system produces a very low TCR effect, for the ultimate in device stability.

The CircuitTrim W778 also includes a new, fully integrated software environment that is dedicated to chip resistor trimming. This Windows-based software makes more efficient use of system resources, further increasing throughput. From a user perspective, the software provides all the necessities required for processing, requiring virtually no programming support.

According to Paul Chase, Product Line Manager, “The new W778 provides great value for our customers, allowing them to reduce inventory, increase their range of device adjustment capability, and increase throughput, with fewer hassles. In today’s competitive environment, this allows them to reduce capital costs while increasing responsiveness to their customers’ needs.”