| |
Provides
results that are unaffected by variations in board
and component appearance, for the industry's lowest
false accept/reject rates.
|
| |
Meets the
most demanding cycle time requirements with 100% inspection
|
| |
Industry’s
best inspection data accuracy & reliability via patented
3-D laser scanning |
| |
Uses
3-D height data to measure solder paste volume, the most
important variable for producing high quality solder joints
|
| |
Reduces
scrap and rework later in the assembly process |
| |
Designed to
accommodate very large boards, up to 610x660 mm
|
|
Ease of use during
set-up & operation |
