WaferRepair™ M435 - Fuse Processing System


  “Total solution” system technology to process extremely tight-pitch fuse structures for exceptional yield enhance-
ment on semiconductor devices,  including 90nm technology.

High-yield laser process: safely and cleanly
processes metal links
Patented high-speed positioning system optimizes throughput and enables a 50,000 links/second processing rate
Precise <0.170µm (|mean| + 3σ) system accuracy ensures safe, reliable processing
Minimum laser spot size of 1.4µm