SVS™ 8200 SPI - Solder Paste Inspection System


  Patented 3-D solder paste inspection, for precise height and volumetric measurements, the best indicators of final solder joint quality.

Small Footprint, High Reliability System Inspects Panels up to 254mm x 406mm (10 in. x 16 in.)
Optimized for High-Throughput Solder Paste Inspection; Also Performs Component Placement Inspection
Meets the Most Demanding Cycle Time Requirements with 100% Inspection
Industry's Best Inspection Data Accuracy and Repeatability via Patented 3-D Scanning Laser
Off-Line Programming & CAD Support Software for Simplified Setup
Real-Time Statistical Process Control
Easy-to-Use, Configurable Operator Interface Requires Minimal Operator Training